NEO Semiconductor has just unveiled the development of its new 3D X-AI chip technology, which aims to replace DRAM chips inside of HBM to solve data bus bottlenecks, by enabling AI processing through ...

Families and those of you beginning your journey into the world of 3D printing might be interested in a new entry-level 3D printer created by the team over at X-MAKER. Equipped with a 3.5 inch ...

The world’s first 3D NAND-like DRAM is targeted to solve DRAM’s capacity bottleneck and replace the entire 2D DRAM market; makes manufacturing and scaling memory with higher densities and capacities ...

Neo Semiconductor has announced the world’s first 3D stackable DRAM technology, called 3D X-DRAM, that could revolutionize computer memory. Neo estimates 3D X-DRAM can achieve 128Gb density with 230 ...

NEO Semiconductor, a US-based company, has introduced groundbreaking 3D X-DRAM technology that streamlines and economizes the three-dimensional production of DRAM memory cells. This innovation offers ...

NEO's IGZO-based 3D X-DRAM delivers up to 512Gb density and 450-second retention with ultra-low power consumption — built on 3D NAND-compatible processes and optimized for AI, in-memory computing, and ...

NEO Semiconductor, a developer of technologies for 3D NAND flash memory and 3D DRAM, has announced the development of its 3D X-AI chip technology. Targeted to replace the current DRAM chips inside ...

Dear readers, it is time to rumble yet again. The MonsterVerse is back in play, and both Kong and Godzilla are back to take the fight to any Titans who stand in their way. So since we’re already ...

AOSEED has introduced an exciting new product to the world of 3D printing, the X-MAKER JOY Kid-Friendly 3D Printer. Designed specifically for children, this innovative printer merges creativity with ...