Elma Electronic released the JetSys-2010 industrial-grade, rugged, small-form-factor (SFF) platform for AI inference computing, facilitating the ability to develop high-performance computing systems ...

V SiC power modules includes a 608-A half-bridge module with 2.4-mΩ on-resistance and best-in-class thermal resistance.

This report presents an integrated approach to the efficient design of power modules used in electric vehicles and other high-power systems. The proposed flow enables the design of power modules for ...

The Standardization Group for Embedded Technologies (SGET) has released SMARC Design Guide v2.2, hot on the heels of SMARC Module Specification v2.2. “This updated version of the design guide provides ...

The need to mitigate climate change is driving a need to electrify our infrastructure, vehicles, and appliances, which can then be charged and powered by renewable energy sources. The most visible and ...

IZMO today announced that its specialized division, izmo Microsystems, has successfully designed a high complexity 3D System-in-Package (SiP) module for Space Payload Camera Electronics. This ...

Last month’s column talked about a simpler way to exchange stackups with manufacturing partners. This month, continuing the ...

Explore how repairable electronics, modular tech, and growing right to repair laws are reshaping consumer devices, reducing e ...