Partnership with NXP Semiconductor to incorporate secure microcontroller IC in new HID Global ultra-thin Polycarbonate (PC) ePrelaminate inlay solution. Ideal for electronic ID (e-ID) cards and is ...
Tageos has released its newly designed EOS-450 U9 RAIN RFID inlay, specifically tailored to meet the operational needs of quick service restaurants (QSRs). Using NXP Semiconductor’s UCODE 9 IC, Tageos ...
PHOENIX, May 09, 2017 (GLOBE NEWSWIRE) -- NXP Semiconductors N.V. (NASDAQ:NXPI) pushes the boundaries of RAIN RFID innovation with the launch of its new global UCODE 8 RAIN RFID chip platform that ...
HID Global, a worldwide leader in secure identity solutions, today announced an ultra-thin Polycarbonate (PC) ePrelaminate inlay for electronic ID (e-ID) cards that is more than 30 percent thinner ...
NXP Semiconductors announced that its SmartMX secure contactless microcontroller chip has been chosen to power the new German contactless National Identity card. The German government has selected NXP ...
Eindhoven, the Netherlands: SmartMX chip platform comprises a number of security features to guard against reverse engineering and attack scenarios with light and lasers. The German government has ...
ADLINK OSM-IMX95 is an OSM Size-L solder-on system-on-module powered by an NXP i.MX 95 hexa-core Arm Cortex-A55 SoC with an up to 2 TOPS eIQ Neutron NPU/AI accelerator. It follows the OSM-IMX93 OSM ...
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