Packaging has always been a balancing act. Consumer packaged goods (CPG) companies must weigh cost versus performance and market appeal versus machinability. As interest in sustainable packaging has ...

For decades, packaging design has been a painstaking process, with designers and brands having to juggle multiple complex tools to complete just a single project. The outcome has often been riddled ...

AI packaging tools provider Pacdora is preparing to introduce a comprehensive AI-powered solution for design and marketing to transform the packaging creation process. With more than six million users ...

Fan-out panel-level packaging (FOPLP) promises to significantly lower assembly costs over fan-out wafer-level packaging, providing the relevant processes for die placement, molding and redistribution ...