Abstract: This paper presents an analysis approach comparing the influence of epoxy molding compound (EMC) materials to be used in doubles-sided cooling (DSC) power modules. Different from typical ...

Abstract: In this study, impacts of transfer molding material on electrical performance of a Power Amplifier (PA) module for GSM/GPRS mobile phone application were characterized. Critical areas on the ...

Vishay Intertechnology Inc., a global manufacturer of passive and discrete solutions, kicked off the launch of its new MAACPAK power modules, catering to silicon carbide (SiC) MOSFETs. These offer ...