As part of the deal, L&T Semiconductor Technologies (LTSCT) has acquired R&D equipment, design patents and various intellectual properties related to power module technologies of Fujitsu General ...

SAN JOSE, Calif.--(BUSINESS WIRE)--Automotive engineers are constantly looking for ways to reduce fuel consumption and lower CO 2 emissions, while at the same time lowering overall system costs. To ...

The DRV7308 is the industry’s first 650V, three-phase GaN IPM for 250W motor drive applications used in major home appliances and heating, ventilation and air-conditioning (HVAC) systems. The GaN IPM ...

TOKYO, September 30, 2024--(BUSINESS WIRE)--Mitsubishi Electric Corporation (TOKYO: 6503) announced today that its Power Device Works’ Fukuyama Factory has begun large-scale supply of power ...

Optimized for high bus voltage applications, these devices are designed to handle bus voltages exceeding 1000V. The power pins of the series are thickened to 2mm, enabling the devices to carry higher ...

Navitas Semiconductor has announced the launch of its new SiCPAK™ power modules, which utilize innovative epoxy-resin potting technology alongside proprietary trench-assisted planar SiC MOSFET ...

KYOTO -- Japanese electronics group Rohm has developed a silicon carbide (SiC) power semiconductor device designed to be 50% more energy-efficient than competing parts, opening up the prospect of ...