Imagine a device that lets you move heat very quickly from one place to another, yet needs no power, no electricity, no pumps ...

Inspired by hierarchical structures found in nature, a research team from the Hefei Institutes of Physical Science of the ...

University of Houston researchers have made a groundbreaking discovery in thermal conductivity, overturning an existing theory that boron arsenide (BAs) couldn’t compete with the heat conduction of a ...

NIMS, in joint research with the University of Tokyo, AIST, the University of Osaka, and Tohoku University, have proposed a ...

The demand for cost-effective but increasingly greater computing power over the last fifty years has driven research and development into new materials and processes to meet the demand. Devices have ...

Graphene, a material which consists of a single layer of carbon atoms, has been celebrated by many as the 'next big thing' in material science. But according to researchers, its thermal properties may ...

Graphene, a material which consists of a single layer of carbon atoms, has been celebrated by many as the "next big thing" in material science. But according to Purdue University researchers, its ...

Researchers have discovered a way to make a versatile thermal conductor, with promise for more energy-efficient electronic devices, green buildings and space exploration. They have demonstrated that a ...

Scientists may have found the answer to smaller and faster chips that could usher in the future of processors, and that answer might be using silicon-28 nanowires. Although the technology was ...

In any electronics workshop, thermal paste is essential. A dense substance called thermal paste is used to enhance heat transfer between electronic parts and heat sinks. In reality, not all energy is ...