A new technical paper titled “Energy-/Carbon-Aware Evaluation and Optimization of 3D IC Architecture with Digital Compute-in-Memory Designs” was published by researchers at Cornell University. “In ...

Ansys HFSS-IC Pro™ platform is certified for system-on-chip electromagnetic extraction with TSMC's N5 and N3P process technologies Ansys RedHawk-SC™ and Ansys Totem™ power integrity platforms are ...

Thermal challenges in 3D-IC designs can cause a significant risk in meeting performance specifications. While the pace of Moore’s Law has slowed in recent years, system technology co-optimization ...

This is an AI-generated image used for representation purposes. NEW DELHI: India’s geospatial technology firm Genesys International Corporation has integrated DIGIPIN, the Department of Posts' digital ...