3D-ICs bieten mehr Leistung und Effizienz durch vertikal gestapelte Chiplets, erhöhen aber die Komplexität durch thermische, ...

3D-IC technology marks a pivotal shift from scaling in two dimensions to scaling in three. By bringing compute, memory, and ...

Cadence is trying to automate more aspects of the chip design process with Integrity 3D-IC, a suite of software tools it says can help engineers develop faster, less power-hungry chips using 3D ...

The automotive industry is experiencing a significant transformation as it adopts innovations like autonomous driving technologies and ultra-connected ecosystems. At the core of this change is a ...

The rapid adoption of 3D integrated circuits (ICs) and heterogeneous packaging heralds a new era in semiconductor design. Benefits are clear: greater functional density, reduced footprint, and ...

The mainstream adoption of 3D-IC has become a question mark due to critical challenges ranging from early-stage chip designs to 3D assembly exploration to final design signoff. A new EDA tool claims ...

PARIS — The Electronics and Information Technology Laboratory of the CEA (CEA-Leti) of France and Docea Power SAS (Moirans, France) announced they have sealed a laboratory agreement to combine their ...

Join members of the development team for a look at Operencia from a Design and 3D level building perspective as they discuss how a level comes to life, and more. Operencia: The Stolen Sun will be ...