Graphics processors with 3D transistors could come to smartphones and tablets through a technology collaboration between Imagination Technologies and contract chip maker TSMC (Taiwan Semiconductor ...
3D-IC technology marks a pivotal shift from scaling in two dimensions to scaling in three. By bringing compute, memory, and ...
Intel said on Wednesday it will release its first Xeon server chips with 3D transistors this quarter, in a move that analysts said would intensify the cloud hardware battle with rival Advanced Micro ...
Researchers unveil 3D transistors using 2D semiconductors, enabling energy-efficient, high-performance electronics with unprecedented miniaturization. (Nanowerk News) In a significant advancement for ...
Intel Wednesday demonstrated its revolutionary three-dimensional (3-D) Tri-Gate transistor technology in a 22-nm microprocessor, code-named Ivy Bridge, that is already being used in prototype laptops, ...
In industry, we see more and more examples of systems being built through heterogeneous integration leveraging 2.5D or 3D connectivity. In this interview, Eric Beyne, Senior Fellow, VP R&D and Program ...
As integration density continues to increase, it becomes even more difficult to make electronic components for complex applications in nanoelectronics — such as navigation systems or computer ...
MILPITAS, Calif.--(BUSINESS WIRE)--GLOBALFOUNDRIES today accelerated its leading-edge roadmap with the launch of a new technology designed for the expanding mobile market. The company’s 14nm-XM ...
The race to manufacture the most power-efficient and fastest chips is gaining momentum, with contract chip manufacturer GlobalFoundries on Thursday announcing technology advances that analysts said ...
The chipmaker plans to unveil more details behind its Tri-Gate transistor, an experimental circuit that could be important in the company's quest to keep up with Moore's Law. Michael Kanellos is ...
There’s no two ways around it: The PC is slowing down with age. That may be a bit harsh—computers are faster and smaller than ever before—but processor performance simply isn’t advancing at its past ...
In industry, we see more and more examples of systems being built through heterogeneous integration leveraging 2.5D or 3D connectivity. In this interview, Eric Beyne, Senior Fellow, VP R&D and Program ...
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