Semiconductor packaging has evolved from traditional 1D PCB designs to cutting-edge 3D hybrid bonding at the wafer level, enabling interconnect pitches in the single-digit micrometer range and ...

Austin, May 14, 2025 (GLOBE NEWSWIRE) -- 3D IC and 2.5D IC Packaging Market Size & Growth Insights: According to the SNS Insider Report, “The 3D IC and 2.5D IC Packaging Market was valued at USD 51.81 ...

Emerging advanced semiconductor packaging technologies, such as 2.5D and 3D hybrid bonding, are crucial for enhancing system performance across various applications such as AI and high-performance ...

Have you ever felt that reality is deeper than what meets the eye? That perhaps our everyday experience is just the surface ...

In the rapidly evolving world of ASIC design, the shift from monolithic to 2.5D and 3D multi-die architectures represents a significant leap forward. This approach, which integrates multiple chiplets ...

2.5D and 3D packaging technology: The 2.5D and 3D packaging technologies encompass various packaging techniques. In 2.5D packaging, the choice of interposer material categorizes it into Si-based, ...

YOKOHAMA, Japan, Aug. 27, 2025 /PRNewswire/ -- Socionext, the Solution SoC company, today announced the availability of 3DIC support in its portfolio of well-proven capabilities for the delivery of ...

A new technical paper titled “Leveraging 3D Technologies for Hardware Security: Opportunities and Challenges” was published by researchers at the University of California, Santa Barbara and Columbia ...