Design-Reuse

GUC Leverages 3DIC Compiler to Enable 2.5D/3D Multi-Die Package

WeiHsun is a guest author and Deputy Manager, Core Methodology Department, at Global Unichip Corp. In the rapidly evolving world of ASIC design, the shift from monolithic to 2.5D and 3D multi-die ...
Semiconductor Engineering

What Is 3D-IC Technology? Fundamentals, Architecture, And Design Concepts

3D-IC technology marks a pivotal shift from scaling in two dimensions to scaling in three. By bringing compute, memory, and ...
Yahoo Finance

Nextech3D.ai Sees Ecommerce Industry Shift Accelerating to 3D Models As Major Ecommerce Platforms Discontinue 360 Spin Experiences In Favor of 3D-AI and Augmented Reality (AR ...

TORONTO, ON / ACCESSWIRE / June 18, 2024 / Nextech3D.AI (OTCQB:NEXCF)(CSE:NTAR)(FSE:1SS), a patented 2D-3D Generative AI-Powered 3D model supplier (Patent #11,948,248) for Amazon, Miele, P&G, Kohls, ...
Yahoo Finance

3D IC and 2.5D IC Packaging Market to Worth USD 120.66 Billion by 2032, at a CAGR of 9.88% | SNS Insider

Austin, May 14, 2025 (GLOBE NEWSWIRE) -- 3D IC and 2.5D IC Packaging Market Size & Growth Insights: According to the SNS Insider Report, “The 3D IC and 2.5D IC Packaging Market was valued at USD 51.81 ...
Semiconductor Engineering

2.5D, 3D Power Integrity

Chris Ortiz, principal applications engineer at ANSYS, zeroes in on some common issues that are showing up in 2.5D and 3D packaging, which were not obvious in the initial implementations of these ...