High-performance bonding materials like OEM-specified polyurethane and acrylic tapes are the ideal method when it comes to automotive attachment applications. Selecting the right tape for your ...
Abstract: Three dimensional integrated circuits (3D-ICs) have being developed to improve existing 2D designs by providing smaller chip areas, higher performance and lower power consumption. With the ...
Newson Gale's Bond-Rite EZ grounding and testing assembly is designed for applications where operators must establish a temporary low-resistance bond or connection to a local ground point. It should ...
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