New Electronics

CEA-Leti achieves low-temperature CMOS breakthrough for 3D chip integration

CEA-Leti has announced a major advance in semiconductor manufacturing, successfully fabricating fully functional 2.5 V SOI ...

Microscale CMOS chip reshapes optical control for scalable quantum computers

CMOS-built optical phase modulators shrink laser control hardware and power use for trapped atom quantum computers, enabling ...
NextBigFuture

Seeing The Invisible With A Graphene-CMOS Integrated Device

In their paper published in the journal Nature Photonics they combine this graphene-CMOS device with quantum dots to create an array of photodetectors, producing a high resolution image sensor. When ...
EDN

Estimating Power Dissipation in CMOS Devices

This application note describes ways to estimate power dissipation of individual CMOS logic devices in a system. It will help users determine if their designs raise any power dissipation concerns. Due ...
Design-Reuse

CMOS Micro Device announces a breakthrough in low power high density CAM technology

CAMPBELL, Calif. -- October 22, 2002 -- CMOS Micro Device, Inc. (CMD), a leading developer of high speed, low power Ternary Content Addressable Memory (TCAM) technology, today announced availability ...
EDN

Using CMOS and BiCMOS Logic Devices

As general purpose components, logic devices are used at different frequencies and power supply voltages in many different varieties of applications. This large diversity has produced the need to ...
Design-Reuse

Technologist backs low-voltage CMOS for SoC devices

SAN FRANCISCO — In a surprising turn, plenary speaker Dennis Buss, technology vice president of Texas Instruments Inc., told thousands gathered here for the International Solid-State Circuits ...
News Medical

Using CMOS Devices to Capture Cell Images

Complementary Metal Oxide Semiconductor (CMOS) is a type of circuit known to be cost-effective and efficient. These circuits are found in many day-to-day items, such as batteries and the image sensors ...
New Electronics

Imec demonstrates Si FinFET CMOS devices

imec has presented a tungsten (W) buried power rail (BPR) integration scheme in a FinFET CMOS test vehicle, which does not impact the CMOS device characteristics. Using this week's 2020 Symposia on ...
ExtremeTech

With Spintronics, Intel Sees Efficiency, Density Scaling Far Beyond CMOS

Conventional CMOS scaling has entered a state of terminal decline. That's the bottom-line takeaway, when you cut through the marketing spiel from companies and look at the expected improvements ...
Electronic Design

Twisted Bonding Technology Speeds Up CMOS Devices

Improved bonding technology helped Toshiba and IBM Corp. develop a higher performance CMOS FET. CMOS has traditionally played a central role in semiconductor design, a position now under threat as ...