CEO Andy Hsu will introduce new applications and variations for 3D NAND flash and 3D DRAM, including a new AI application called "Local Computing", drastically increasing AI chip performance to a new ...

The new Synopsys ARC® NPX Neural Processing Unit (NPU) IP family delivers the industry’s highest performance and support for the latest, most complex neural network models. The Synopsys ARC ... The ...

LONDON — Belgian research organization IMEC has extended its work on 32-nm CMOS device scaling to include a project on DRAM MIMCAP (metal-insulator-metal capacitors) process technology. The group says ...

Micron has begun sampling of its first LPDDR5X memory devices produced using its new 1γ (1-gamma) fabrication process that uses EUV lithography with customers, the company announced at its conference ...

Winbond Electronics has kicked off mass production of specialty DRAM memory using 20nm process technology, with plans to transition to a newer 16nm process, according to the Taiwan-based chipmaker.

With the semiconductor industry moving toward 3D DRAM, 3D logic architectures, and 1000+ layer 3D NAND stacks, 1 mechanical failures may become more common. Due to the complexity of these structures, ...