Innovation in semiconductor design today is energized primarily by AI/ML, data centers, autonomous and electric vehicles, 5G/6G, and IoT. Recently developed 2.5 and 3D-IC silicon-based packaging ...
Abstract: This study introduces a novel modeling framework for 3-D woven spacer composite antenna (3DWSCA), incorporating the conformal finite-difference time-domain (CFDTD) method. The framework ...
Autonomous Electromagnetic Simulation and Modeling of QFN Micro-Electronic Packages Using LLM Agents
Abstract: This paper presents a novel approach to automating the electromagnetic simulation workflow for packaging using Large Language Model (LLM) agents. We demonstrate the use of LLM-based agents ...
ISTA Kinshasa, Electrical Engineering, Kinshasa, The Democratic Republic of the Congo.
Interoperability between XFdtd and Wireless InSite incorporates near-field antenna effects into simulations of antenna performance so that mobility, multipath, and interactions with body-worn devices ...
SAE Transactions, Vol. 110, Section 7: JOURNAL OF PASSENGER CARS: ELECTRONIC AND ELECTRICAL SYSTEMS (2001), pp. 237-244 (8 pages) The paper given contains the results of the modeling of a new type of ...
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Perlmutter supercomputer uses 7,000 GPUs and 11B grid cells to model quantum chip
More than 7,000 NVIDIA GPUs have just simulated a quantum microchip, and in doing so, pushed the limits of one of the world’s most powerful supercomputers. A broad association of researchers from ...
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