IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...

Advanced packaging of semiconductor chips has emerged as a key enabler in many of today's electronic system products. Put another way, package selection is increasingly important to the success of the ...

Abstract: The implementation of a 3D IC is typically accomplished by multiple design teams, in multiple geographies, using a variety of design tools. Types of designs include a simple package, with an ...

The shift toward more complex IC packages requires more advanced inspection systems in the production flow to capture unwanted defects in products. This includes traditional optical inspection tools ...

Rising demand for chips is hitting the IC packaging supply chain, causing shortages of select manufacturing capacity, various package types, leadframes and even some equipment. Spot shortages for some ...

STMicroelectronics has introduced two miniature IC package types which are less than one millimetre thick. The MSOP8 package is claimed to be 23 per cent smaller than its predecessor, the TSSOP8. Its ...

STMicroelectronics has introduced two miniature IC package types which are less than one millimetre thick. The MSOP8 package, also called TSSOP8 3×3 according to JEDEC standards, is claimed to be 23 ...

Abstract: This paper presents a methodology for scalable modeling of IC packages by lumped element equivalent circuits. The response surface methodology is used for modeling of the IC package pins, ...