As technology migrates from 90 nm to 65 nm and, eventually, to the 45-nm node, fast yield ramp-up is increasingly difficult to achieve due to the sub-wavelength effects of lithography. While minimum ...

The main objective of this paper is to explain the various types of design rule checks (DRC) violation, their causes and how to fix the various design rule checks (DRC) at lower technology node on ...

In VLSI layout design, density issues are critical factors influencing the performance, yield, and reliability of integrated circuits. This whitepaper delves into the several types of density issues, ...

As new technology nodes have become available, memory has been one of the most aggressive semiconductor applications to adopt advanced process technology. The relentless demand by users of electronic ...

Why should there be an interest in Package Assembly Design Kits (PADK) today? For the most part, it is due to the advancement in the accumulation of files forming the PADK now offering a customized ...

Your design team would like a PCB layout checklist for improving ESD immunity. What would you add to the list? Here are a few layout design rules that will help you reduce the ESD risks on your next ...