IC packaging, typically an afterthought in the design of a new-generation SoC, is particularly troublesome for communications circuits and high-speed interface circuits. Everyone wants small size and ...
For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.
Stay up to date with everything that is happening in the wonderful world of AM via our LinkedIn community. Just introduced by Inkbit, Pack Studio is a manufacturing software platform developed by to ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback