The TSL2014 and TSL210 are linear sensor arrays for scanning longer documents, such as bank forms, paper currency notes and labels covered by the A6 format, which has become a standard size. The ...
The shift to advanced packaging in 3D and 2.5D IC design is making the numerical analysis of thermal warpage in electronic devices a crucial part of the design process. A reliable numerical tool ...
ABSTRACT Thermal effects on scalar dispersion in and above a cubical building array are numerically investigated using the parallelized large-eddy simulation model (PALM). Two cases (no heating and ...
Faced with the prospect of developing custom logic for a new, highly parallel processor architecture for a multimedia processor system on chip (SoC), an R&D team had to implement a strategy to ...
This paper presents our initial work in performing large-eddy simulations of tidal turbine array flows. First, a horizontally periodic precursor simulation is performed to create turbulent flow data.
This article shows a common approach to the simulation of electromechanical problems. A parametric set of 3D magnetostatic simulations are carried out using CST EM Studio (CST EMS) on a linear ...
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