Thermal analysis is the process of measuring how a material/device behaves at different temperatures. For many applications, especially single materials, a thermal analysis is a physical analytical ...
Computational fluid dynamics software tools can be useful in considering the effect on a printed circuit board of such things as package selection, board layout and structure as well as enclosure ...
Thanks to the relatively recent rise of affordable board production services, many of the people reading Hackaday are just now learning the ropes of PCB design. For those still producing the FR4 ...
Pulsonix, the industry-leading PCB design software from WestDev Ltd, has announced a major enhancement to its design ecosystem: a direct interface between Pulsonix and ADAM Research's TRM (Thermal ...
Join us on Wednesday, March 30 at noon Pacific for the PCB Thermal Design Hack Chat with Mike Jouppi! Most of the time, designing a printed circuit board is a little like one of those problems in an ...
A semiconductor manufacturing company has little control over the system in which its parts are used. However, the system in which the IC is mounted is critical to overall device performance. For ...
Electronic enclosures tend to have high thermal mass, which gives an opportunity to use them as a heat sink for a design. By ...
There are two golden rules to thermal design: start simple and start early. The heat-flow path from the junction to the ambient, usually air in the local environment, determines a component’s ...
Printed Circuit Boards (PCBs) are a fundamental part of the majority of electronics systems. They are primarily designed to mechanically support and electrically connect electronic components, and are ...
Next-generation wireless communication and radar systems often demand increased RF power within a smaller footprint to meet the performance and size requirements of their respective commercial and ...
EDA specialist Pulsonix has announced the release of Pulsonix 14.0, the latest iteration of its PCB design software.
When applications become more complex, higher data rates or high frequencies are required. However, with increasing functions, more power dissipation will be generated. Furthermore, temperature is ...