Kioxia says it has developed highly stackable oxide-semiconductor channel transistors capable of supporting high-density 3D ...

Process and device technologies have had to overcome numerous technical challenges as DRAM memory devices have transitioned between different cell architectures. When DRAM technology nodes went beyond ...

Dynamic random-access memory (DRAM) chips contain many other transistors besides the access transistor to enable full operation of the DRAM memory. These peripheral transistors must meet stringent ...

Semiverse Solutions, particularly SEMulator3D, can enhance semiconductor engineering in several ways. SEMulator3D is a software platform for semiconductor process modeling and virtual fabrication. 1 ...

For decades, compute architectures have relied on dynamic random-access memory (DRAM) as their main memory, providing temporary storage from which processing units retrieve data and program code. The ...

Since its 1970 debut, DRAM has supplanted magnetic core memory as an essential element in von Neumann's computer architecture. By the mid-1980s, fueled by the popularity of PCs and workstations, DRAM ...

After memory products like NAND Flash and DRAM, it's reported that Samsung Electronics will conduct R&D for a "3D stacking" technology that can vertically stack system semiconductor transistors.

NEO Semiconductor is once again announcing a new technology that hopes to revolutionize the state of DRAM memory. Today, the company unveiled two new 3D X-DRAM cell designs, 1T1C and 3T0C. The ...

PLAINVIEW, N.Y., Dec. 01, 2025 (GLOBE NEWSWIRE) -- Veeco Instruments Inc. (NASDAQ: VECO) today announced that a leading semiconductor memory company has selected Veeco’s laser spike annealing (LSA ...