Abstract: The advanced IC packaging technologies such as 3D-TSV, 2.5D interposer, PoP and Flip-Chip wafer micro-bumping are being implemented for consumer electronic products like as mobile phones, ...

Abstract: This paper describes the study of a new pattern plate, direct current (DC) electrolytic copper plating chemistry for IC package (PKG) application. The new chemistry shows good via-filling ...

How and why to achieve higher-density placement and routing. PCB pin count and interconnect densities are increasing almost daily. Due to the associated high frequencies and speed, not only are ...