Structural and Thermal Aware Methodology for Placement in 2.5D Integration” was published by researchers at Pennsylvania ...

A new technical paper titled “Memory Prefetching Evaluation of Scientific Applications on A Modern HPC Arm-based Processor” ...

An Open-Source and Configurable RISC-V Graphic Processing Unit for TinyAI Applications” was published by researchers at EPFL.

High-voltage PCB spacing; HBM4; AI changes engineering teams; ion beam etching; wafer market and raw materials.