Structural and Thermal Aware Methodology for Placement in 2.5D Integration” was published by researchers at Pennsylvania ...

A new technical paper titled “Memory Prefetching Evaluation of Scientific Applications on A Modern HPC Arm-based Processor” ...

An Open-Source and Configurable RISC-V Graphic Processing Unit for TinyAI Applications” was published by researchers at EPFL.

High-voltage PCB spacing; HBM4; AI changes engineering teams; ion beam etching; wafer market and raw materials.

Benchmarking 3D-IC cooling; rad-hard flip-flops; high-speed data error correction. Researchers from Massachusetts Institute ...

AI export rule to be scrapped; SEMI, EU request; Cadence, Nvidia supercomputer; AI co-processor; Imagination's new GPU; semi ...

Supply chain vulnerabilities, hardware attacks, and communications hacks are rife. Autonomous technology poses extra threats.

A new technical paper titled “Hardware vs. Software Implementation of Warp-Level Features in Vortex RISC-V GPU” was published ...

Exploiting Exclusive System-Level Cache in Apple M-Series SoCs for Enhanced Cache Occupancy Attacks” was published by ...

A new technical paper titled “Key Safety Design Overview in AI-driven Autonomous Vehicles” was published by researchers at ...

Semiconductors designed for spacecraft face a range of extreme conditions that impact aging. A reliable source of power is ...

Intel, TSMC, and Samsung are developing a broad set of technologies and relationships that will be required for the next generation of AI chips.